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李世玮教授学术报告

发布时间:2018-12-25    浏览次数:1421

名师名家学术论坛-李世玮教授学术报告
报告题目:Correlation between Package Level and Board Level
Solder Joint Reliability Tests for Portable Electronics
报告时间:2018年12月28日下午15:00-17:00
报告地点:中南大学中铝科技大楼B214
报告人:李世玮 教授
香港科技大学机械及航空航天工程系讲座教授
先进微系统封装中心主任
香港科技大学深圳研究院院长
报告摘要:
The reliability of solder joints under mechanical impact loading is a major concern to portable electronics. Usually board level drop tests have to be conducted in order to investigate such a kind of issue. Nevertheless, the preparation of board level test samples is very costly and time consuming. The metrology for board level failure analysis is also very difficult and tedious. Therefore, there is always a demand for simpler test methods to investigate the solder joint reliability under mechanical impact loading. This presentation will introduce a package level test method and correlate the package level ball pull/shear test results to the board level mechanical drop test results. The basic requirement is the failure modes in both kinds of tests must be the same. Detailed failure analysis and data correlation will be given. The comparison of results justifies the feasibility of using package level tests to replace board level tests for the characterization of solder joint reliability under mechanical impact loading.

报告人简介:


Ricky Lee(李世玮教授)received his PhD degree from Purdue University in 1992. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. Currently Dr Lee is Chair Professor of Mechanical & Aerospace Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has a concurrent appointment as General Director of HKUST Shenzhen Research Institute and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of 12 best/outstanding paper awards and 5 major professional society awards, Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and Institute of Physics (UK). He is also a Distinguished Lecturer and the Past-President of the IEEE Electronics Packaging Society (EPS).