登陆  
最新更新时间:2017/5/10 9:29:09
王福亮


【王福亮】
机械工程博士、教授、博导。
教育部新世纪人才、霍英东青年教师基金、湖南省杰出青年基金、湖南省青年骨干教师。获得中南大学西南铝优秀教师奖。
近五年发表SCI论文30余篇。
研究方向:微电子三维封装工艺与装备(TSV填充、柔性电子、超声键合)
电子邮箱:wangfuliang@csu.edu.cn
QQ14053862
微信:
办公室:新校区机电楼A314
 
【教育背景】
19972001   中南大学,机械工程,本科
20012007   中南大学,机械工程,硕博连读
20132014   加州大学洛杉矶分校,访问学者
 
【科研项目】
  1. 主持2015年国家自然科学面上基金项目:三维封装高密度微铜柱热超声倒装键合强度形成过程与规律研究(No.51575542);
  2. 主持2015年973 项目子课:复杂通道异质薄膜和传输介质的生长规律与纳米精度控制(2015CB057202);
  3. 主持2016年霍英东青年教师基金;
  4. 主持2016年中南大学第三批创新驱动项目;

【学术奖励】
  1. 2015年获教育部高等学校优秀成果奖科技进步一等奖(三维窄节距、大跨度互连封装的关键技术与应用),排名1
  2. 2008年获湖南省科技进步一等奖(超声键合机理、规律与技术研究),排名

【近3年主要论文】
[1]. F. Wang, Z. Zhao, N. Nie, F. Wang*, W. Zhu, Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities, Scientific Reports, 7 (2017) 46639. (IF=5.578)
[2]. Fuliang Wang,Peng Mao,Hu He. Dispensing of high concentration Ag nano-particles ink for ultra-low resistivity paper-based writing electronics, Scientific Reports, 2016,6(2):21398(IF=5.578)
[3].Wang Fuliang, Xiao Hongbin, He Hu, Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns, Scientific Reports, 2016,6(5):26270 (IF=5.578)
[4]. Wang Yan, Zhu Wenhui, Li Xiang, Wang Fuliang*. Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives[J]. Electrochimica Acta, 2016, 221: 70-79. (IF=4.803).
[5]. Fuliang Wang, Feng Wang, and Hu He. Parametric Electrochemical Deposition of Controllable Morphology of Copper Micro-Columns. Journal of The Electrochemical Society, 2016,163(10):E322-E327(IF= 3.014)
[6]Fuliang Wang, Li yijie, and Hu He. Effect of Bis-(3-sulfopropyl) Disulfide and Chloride ions on the Localized Electrochemical Deposition of Copper Microstructures, 2017, (IF= 3.014)
[7]. Wang F, Sun J, Liu D, et al. Effect of Voltage and Gap on Micro-Nickel-Column Growth Patterns in Localized Electrochemical Deposition[J]. Journal of The Electrochemical Society, 2017, 164(6): D297-D301. (IF= 3.014)
[8]. Xiao H, Wang Fuliang*, Wang Yan, et al. Effect of Ultrasound on Copper Filling of High Aspect Ratio Through-Silicon Via (TSV)[J]. Journal of The Electrochemical Society, 2017, 164(4): D126-D129. (IF= 3.014)
[9]. Fuliang Wang, Haixin Zhu, and Hu He. Low temperature sintering of Ag nanoparticles/graphene composites for paper based writing electronics,Journal of Physics D -Applied Physics 2016,49(41):415501 (IF=2.772)
[10]. Hongbin Xiao, Hu He, Xinyu Ren, Peng Zeng, Fuliang Wang*. Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives[J]. Microelectronic Engineering, 2017,170(25):54–58.(IF= 1.277)
[10]. Yun Chen, Fuliang Wang*, Comparison of fundamental frequency and sweep resistance of different wire loops using finite element model, International Journal of Structural Stability and Dynamics, 2015, 15(1), 1450032.12 pages
[11].    Fuliang Wang, Feng Wang. Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(7): 1245-1250.
[12]. Fuliang Wang, Yun Chen, Lei Han, Modeling and experimental study of the kink formation process in wire bonding, IEEE Transactions on Semiconductor Manufacturing, 2014, 27(1),51-59.
[13]. Fuliang Wang, Shaohua Liu, Junhui Li, Lei Han, Heavy aluminum wire wedge bonding strength prediction using a transducer driven current signal and an artificial neural network, IEEE Transactions on Semiconductor Manufacturing, 2014, 27(2),232-237.
[14]. Fuliang Wang, Yun Chen, Lei Han, Investigation of complex looping process for thermosonic wire bonding, IEEE Transactions on Semiconductor Manufacturing, 2014, 27(2),238-245.
[15].Fuliang Wang, Yun Chen, Lei Han, Development of an ultra-long ultra-low n-loop for wire bonding, IEEE Transactions on Semiconductor Manufacturing, 2015, 28(1): 50 - 54.
[16].  Fuliang WANG, High-frequency and low-temperature thermosonic bonding of lead-free micro-solder ball on silver pad without flux, ASME Journal of Electronic Packaging, 2014. 136(3), 031001
[17]. Fuliang Wang, Fan Dengke, Modeling and experimental study of a wire clamp for wire bonding, ASME Journal of Electronic Packaging, 2015, 137(1):011012(6 pages).