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最新更新时间:2017/11/9 12:24:56
韩雷
个人简介

性 别:男
职 称:教授
电子邮件:leihanxyz@yahoo.com.cn

教育背景
1982,1984,1989年在中国科技大学获学士, 硕士, 博士学位。
工作经历
1989-1991 中国科技大学 讲师; 1991-1992 美国 Oregon State University, Research Scientist; 1992-1994 美国 Lehigh University , Research Scientist; 1994-1995 美国 State University of New York, Research Scientist; 1995-2000 厦门大学 副教授,教授; 2000-2001 美国 Case Western Reserve University, Research Associate; 2001-2003 美国 Lehigh University, Research Associate; 2003-今 中南大学 教授,博士生导师。
学术和社会兼职
美国 Society of Experimental Mechanics 会员, 中国仪器仪表学会第5届理事。


学术成果
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Pulsed Holographic and Speckle Interferometry Using Hopkinson Loading Technique to Investigate the Dynamical Deformation on Plates, Proc. of SPIE, 1990, 1358:793-803
动态全息和散斑技术研究薄板在横向冲击下的变形,力学学报 , 1991, 23(5):595-600
Vibration Sensing in Electrorheological Controllable Structure by Embedded Polarimetric Fiber Optic Sensors,Proc. of ASME Annual Meeting, American Society of Mechanical Engineers, Aerospace Division (Publication) AD, 1993, 297
Application of the Integrating Fiber Optic Sensor for Vibration Sensing, <Smart Materials and Structures>, 1995, 4(2):100-105
光纤应变传感器在智能结构研究中的应用, 机械工程学报, 2000, 36(1) :101-105
Study of the multilayer PCB CTEs by moire interferometry, Optics and Lasers in Engineering , 42 (2004) :613–626
Statistical Analysis for Test Lands Positioning and PCB Deformation during Electrical Testing, Microelectronics Reliability, 44 (2004) 853–859
Bondability window and power input for wire bonding, Microelectronics Reliability, 2006, 46(2-4):610–615
热超声倒装键合过程中的非线性动力学行为,半导体学报,2006, 27(11):2056-2063
Wire bonding dynamics monitoring by wavelet analysis, Sensors and Actuators A 137 (2007) 41–50
热超声键合换能系统动力学特性的非线性检验,物理学报,2007,56(07):3820-3827
Effect of Tightening Torque on Transducer Dynamics and Bond Strength in Wire Bonding, Sensors and Actuators A,2008, 141(2):695–702
Experimental Observations on Nonlinear Phenomena in Transducer Assembly for Thermosonic Flip-Chip Bonding, Microelectronic Engineering (2008) , Vol 85/7:1568-1576


学术奖励
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湖南省科技进步一等奖(2008年)