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王彦
个人简介
个人简介

王彦,博士、讲师、硕导。2008.09 - 2011.06在浙江大学化工过程机械专业攻读硕士学位。2011.09 - 2015.10在德国弗莱贝格工业大学(TU-Freiberg)机械系,热加工工程、环境与天然产物加工工程所攻读过程工程专业博士学位。2016年至今,一直在高性能复杂制造国家重点实验室、中南大学机电工程学院(机械工程一级学科、机械设计及理论国家重点学科)从事微电子封装方面的可靠性、传热传质、微流体计算、优化模型研究。目前,参与研究国家973“20/14 nm集成电路晶圆级三维集成制造的基础研究”课题:复杂通道异质薄膜和传输介质的生长规律与纳米精度控制子课题1项以及国家重点实验室自主研究课题1项。近年来在微电子封装领域、流体计算、传热传质等领域的国际主流期刊和会议上发表多篇论文。

教育背景

·2011.09-2015.09 德国 弗莱贝格工业大学(TU-Freiberg) 机械系 热加工工程、环境与天然产物加工工程所 过程工程 攻读博士学位

· 2008.09-2011.06 浙江大学 (211 985) 化工过程机械专业 工学硕士

·2004.09-2008.07 中国矿业大学 (211 985创新平台) 过程装备与控制工程专业 工学学士

研究领域

· 微电子可靠性:封装互连,下填料流动分析,传热传质分析等

· 微结构制造:微结构表征,微结构电化学沉积,微结构刻蚀等

· 仿真和优化:多物理场计算,传热传质模型,过程及流体的模拟、CFD,计算流体动力学,参数估计,非线性优化等

科研项目

· 国家重点基础研究发展计划项目(973计划),2015CB057202,“20/14 nm集成电路晶圆级三维集成制造的基础研究”课题:复杂通道异质薄膜和传输介质的生长规律与纳米精度控制,2015/01-2019/12,在研,参与人

· 国家重点实验室自主研究课题, 应用于微电子多尺度结构的微流体的传热研究,2016.05-2017.12,在研,主持

· 2011.09–2015.10 化工过程的模拟、预测及优化 CSC奖学金德国 TU-Freiberg

· 2010.10-2010.12 动态模型建立和参数优化 德国DAAD奖学金德国柏林工大

· 2009.10-2011.06 优化算法的研究 基金项目: 国家自然科学基金项目(20676117) 浙江大学

· 2009.06-2010.04 液力变矩器动态膨胀试验机 企业合作项目:H20091530 浙江大学

· 2008.02–2008.06 往复式压缩机无级气量调节系统的研究 国家科技支撑项目 浙江大学

联系方式:

邮件:wangyanzju@csu.edu.cn

QQ:358496842

中南大学新校区机电楼A315

其他详见:
http://ami.csu.edu.cn/people

主要论文:国际学术刊物上发表SCI学术论文13篇,其中第一作者或通讯作者9篇

(1) Wang, Y,*; Herdegen, V.; Repke, J.-U.
A Model Approach for the Montan Wax Extraction: Model Development and Experimental Analysis. Separation Science and Technology 50: 2311-2326, 2015. SCI期刊, IF: 1.171

(2) Wang, Y.*, V. Herdegen and J.U. Repke, Identification and Analysis of Mass Transfer Coefficients and Effective Diffusion Coefficients for Models of Solvent Extraction of Montan Wax. Separation Science and Technology, 2016. DOI: 10.1080/01496395.2016.1202978, SCI期刊, IF: 1.171,

(3) Wang, Y.*, V. Herdegen and J. Repke, Numerical study of different particle size distribution for modeling of solid-liquid extraction in randomly packed beds. Separation and Purification Technology, 2016. 171: p. 131-143.SCI期刊2区, IF: 3.299

(4) Yan Wang, Wenhui Zhu*, Xiang Li, Fuliang Wang*, Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives. Electrochimica Acta. DOI: 10.1016/j.electacta.2016.09.144, SCI期刊1区(Top), IF: 4.803

(5) Chengdi Xiaoa, Hailong Liao, Yan Wang*, Junhui Li*, Wenhui Zhua. A novel automated heat-pipe cooling device for high-power LEDs. Applied Thermal Engineering. DOI: 10.1016/j.applthermaleng.2016.10.041. IF: 3.043

(6) F. Wang, X. Ren, P. Zeng, H. Xiao, Y. Wang*, and W. Zhu, Dynamics of filling process of through silicon via under the ultrasonic agitation on the electroplating solution. Microelectronic Engineering, (2017). 180: p. 25-29. (IF=1.806)

(7) F. Wang, P. Zeng, Y. Wang*, X. Ren, H. Xiao, and W. Zhu, High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition. Microelectronic Engineering, (2017). 180: p. 30-34.(IF=1.806)

(8) F. Wang, X. Ren, Y. Wang*, P. Zeng, Z. Zhou, H. Xiao, and W. Zhu, Parameter analysis on the ultrasonic TSV-filling process and electrochemical characters. Journal of Micromechanics and Microengineering, Wang F, Ren X, Wang Y, et al. Parameter analysis on the ultrasonic TSV-filling process and electrochemical characters[J]. Journal of Micromechanics & Microengineering, 2017, 27(10) (IF= 1.794).

(9) Zhu, Wenhui, K. Wang, and Y. Wang*. "A novel model for simulating the racing effect in capillary-driven underfill process in flip chip." Journal of Micromechanics and Microengineering (2017) (IF= 1.794).

(10) H.
Xiao, F. Wang, Y. Wang, H. He, and W. Zhu, Effect of Ultrasound on Copper Filling of High Aspect Ratio Through-Silicon Via (TSV). Journal of the Electrochemical Society, (2017). 164(4): p. D126 - D129. (IF=3.259)

(11) F. Wang, J. Sun, D. Liu, Y. Wang, and W. Zhu, Effect of Voltage and Gap on Micro-Nickel-Column Growth Patterns in Localized Electrochemical Deposition.
Journal of the Electrochemical Society, (2017). 164(6): p. D297-D301. (IF=3.259)

(12) F. Wang, Y. Li, H. He, Y. Wang, W. Zhu, and J. Li, Effect of Bis- (3-sulfopropyl) Disulfide and Chloride ions on the Localized Electrochemical Deposition of Copper Microstructures, Journal of The Electrochemical Society, (2017). 164(6): p. D297-D301. (IF=3.259)

(13) Wang, Feng; Wang, Fuliang; Zhao, Zhipeng; Wang, Yan; Nie, Nantian, A novel model for Through-Silicon Via (TSV) filling process simulation considering three additives and current density effect. Journal of Micromechanics and Microengineering,(2017).(IF=1.794)

会议报告/论文:

(1) Wang, Y.*; Herdegen, V.; Repke, J.-U.: Mathematical Modeling and Prediction of Solid-Liquid Extraction for Montan Wax. 9th European Congress of Chemical Engineering together with 2nd European Congress of applied Biotechnology, The Hague, The Netherlands, 2013.

(2) Wang, Y.*; Herdegen, V.; Repke, J.-U. Impact of particle size distribution in packed bed for solid-liquid extraction for Montan wax. International Solvent Extraction Conference ISEC 2014, Würzburg, Germany

(3) Wang, Y.*; Herdegen, V.; Repke, J.-U. Development and optimization of mathematical models for Montan wax extraction. 10th European Congress of Chemical Engineering together with 3rd European Congress on Applied Biotechnology and 5th European Process Intensification Conference, September 2015, Nice, France

(4) Chengdi Xiao, Hu He, and Junhui Li*, Yan Wang and Wenhui Zhu. Investigation on the effect of multiple parameters towards thermal management in 3D Stacked ICs,17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, P.R. China, 2016.