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朱文辉
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个人简介

朱文辉 联系电话:15874847749 电子邮件:zhuwenhui@csu.edu.cn 地 址:湖南省长沙市岳麓区中南大学新校区机电工程学院(410083) 博士,中组部“千人计划”专家,中南大学教授、博士生导师,973项目首席科学家,国家科技重大专项02专项总体论证专家委员会专家,封测产业创新战略联盟咨询委专家。曾任天水华天科技股份有限公司总工程师、研究院院长,昆山西钛微电子科技有限公司总经理。正在主持国家重点基础研究发展计划(973计划)“20/14nm集成电路晶圆级三维集成制造的基础研究”;曾主持国家科技重大专项极大规模集成电路制造技术及成套工艺(02专项)项目1项、课题3项,国家自然科学基金和国家高技术研究发展计划(863计划)各1项;领导开发了新一代TSV-CIS、3DTSV、FCCSP/BGA、高密度V/UQFN、FCQFN和AAQFN等系列技术并实现量产。曾在英飞凌科技亚太有限公司(Infineon)、新加坡联合科技(UTAC)、新加坡高等计算研究院(IHPC)、Cookson等国际著名的微电子封装企业任资深科学家和日本大阪府立大学任助理教授。获国家重点新产品奖2项、中国半导体创新产品和技术奖3项、ICEPT优秀论文奖3次。发表论文100余篇,国际会议特邀报告10余次,授权专利36项。 教育背景 1991/4 - 1995/1,国防科学技术大学,应用物理,博士 1986/9 - 1988/1,中国科学技术大学,近代力学,硕士 1981/9 - 1986/7,中国科学技术大学,近代力学,学士 工作经历 2014年-至今:中南大学机电工程学院教授、博士生导师 微系统制造科学与工程系主任 2010-2014年:天水华天科技有限公司 总工程师 昆山西钛微电子科技有限公司 总经理 2006-2010年:新加坡联合科技(UTAC)科技研发部 资深经理 2004-2006年:Cookson Electronics Packaging Materials(新加坡) 资深科学家 2001-2004年:英飞凌科技亚太有限公司(Infineon) 一级高级工程师 1999-2001年:受日本文部省邀请在日本大阪府立大学任助理教授 1997-1999年:新加坡高等计算研究院(IHPC) 高级研究工程师 1995-1996年:中国科学技术大学博士后,九六年破格提升为副教授 1988-1991年:中国科学院/石油部渗流流体力学研究所 助理工程师 学术及社会兼职 l 中国封装测试产业创新战略联盟咨询委员会专家;

l 华进半导体先导技术研发中心公司第一届董事会董事(2012-至今);

l 北京工业大学客座教授(2010-至今);

l 上海北京大学微电子研究院兼职教授(2010-2012);

l 《电子封装工艺设备》(2012,化学工业出版社)编委;

l 《电子封装技术与可靠性》(2012,化学工业出版社)编委;

l 美国IEEE会员(2006-2011)和ASME会员(1999-2006);

l Materials Science, Materials Science letters, Packaging Reliability,

International Journal of Impact Engineering等多个国际杂志的审稿人。

l IEEE EPTC(新加坡)会议组委会主要成员(2006-2009)、

论坛与培训课程主席(2008)、

Simulation and Design技术分会主席(2006-2009);

l ICEPT(-HDP)国际会议技术委员会共同主席(2010-2013),

WLP论坛主席(2010),TSV论坛主席(2011),

Simulation and Design分会主席(2008-2010);

l 作为主要成员参与行业三维系统集成的研讨与战略制定(2011)。

代表性成果 一、组织申报与领导实施国家973项目 朱文辉博士2014年2月份加入中南大学机电工程学院,作为项目首席科学家领导组织了中南大学、清华大学、北京大学、中科院微电子研究所、上海交通大学、华中科技大学、中芯国际(上海)集成电路制造有限公司和中科院深圳先进技术研究院共八家参与单位申请了2015年度国家重点基础研究发展计划(973计划)制造与工程科学领域“20/14nm集成电路晶圆级三维集成制造的基础研究”项目,项目中央财政经费预算3600万元,其中前两年项目预算批复1665万元。

二、组织申报与领导实施国家重大科技02专项

l 多圈V/UQFN、FCQFN和AAQFN封装工艺技术研发及产业化

朱文辉博士2010年就职华天科技公司后,组织封装技术研究中心、设备部、财务部等相关人员申报了2010年02专项 “多圈V/UQFN、FCQFN和AAQFN封装工艺技术研发及产业化”项目。组织学习项目申报指南,亲自撰写项目要点,研究分析各项课题内容,指导各小组分工编写相关内容,多次组织讨论修改定稿并按期上报,并积极向项目办宣讲推介项目。

项目启动以后,积极主动组织实施,按照项目任务书要求,朱文辉博士领导研究出具有自主知识产权的全新AAQFN产品,开发了 V/UQFN, FCQFN等系列新产品,突破和掌握了引脚后蚀刻分离等技术,大大提高了QFN的封装密度,将QFN I/O数提高到441L,建立了Flip Chip工艺能力,开发出5种V/UQFN新产品、7种FCQFN新产品、3种AAQFN及3种FCBGA系列产品,申请专利68项,已授权30项,实现了高端技术先进封装的重大突破,为国内相关高端芯片封装提供了重要服务平台。

l 通讯与多媒体芯片封装测试设备与材料应用工程

2011年组织了“通讯与多媒体芯片封装测试设备与材料应用工程”申报,积极与专项办和责任专家联系沟通,协调解决申报中的问题与困难,实现了项目的成功申报,并顺利开展了实施工作。

l 高密度倒装封装的快速MPP平台建设

指导并组织了02专项“高密度倒装封装的快速MPP平台建设”项目申报及实施工作,推动国内高端FC基板材料的应用。

与此同时,朱博士还参与策划和组织国家重大02专项子课题“MCP封装技术研发与产业化”的实施。该课题已通过专项验收。

另外,朱博士领导立项研究的“阵列式镜头智能成像TSV-CIS集成模块工艺研发与产业化”项目、“FC+WB三维混合集成封装高压技术研发与产业化”及“先进QFN封装设备与材料示范工程”等项目也都通过2013年国家科技部02重大专项的立项初审。

三、国家认定的企业技术中心成立及创新平台建设

领导管理了一个国家认定的企业技术中心,加强了华天科技现有可靠性实验室的建设,筹建了一个封装表征与可靠性实验中心,设计与仿真分析平台,推动成立了中科华天西钛先进封装联合实验室。

以国家专项的带动,开辟了新的Flip chip产品方向,带领研发具有自主知识产权的AAQFN系列产品,建立了Flip chip和蚀刻新工艺的研发工程线。

加强了企业设计与仿真分析平台的建设,结合企业目前封装现状引入了HFSS、POWER SI、FLOTHERM+FLOPACK、UPD、ANSYS MECHANICAL、Molder3D等软件,从各仿真软件的引进、配套平台的建设、利用模型复现实际系统中发生的本质过程,到软件的完善升级、更新换代,承担了总体的规划实施。通过三年的努力,在设计、封装、测试、实验分析等方面建立了完善的设计与仿真分析能力,将仿真的技术应用到微电子器件封装设计中,改变了研发方法,缩短了研发周期,满足了客户需要,节省了研发成本,并为加工和生产过程中问题提供了快速有效的新方案。

四、组织申报的项目及国家、省、部级科技奖项

l 2010-2012年组织向国家、省市申报项目、奖项共计50项,获国家资助资金700万元、奖励88万元。

l 2010-2012年获得国家重点新产品奖2项、中国半导体创新产品和技术奖3项、甘肃省年度优秀新产品新技术奖5项。

l 2010-2012年领导完成了科技成果及甘肃省优秀新产品/新技术鉴定17项,其中,国际先进水平11项,国内领先水平6项。

l 申报天水市科技进步奖

2010-2012年申报天水市科技进步奖3项,均获得天水市科技进步一等奖。

部分论文著作 a) Book chapter 1. 秦飞,安彤,朱文辉,曹立强,可靠性物理与工程(译著),科学出版社,2013. 2. W.H. Zhu*, M. Yoshida and S. Tanimura: “Tensile Fracture in Al acted by 300ps laser pulses” - Chapter 16 in Engineering Plasticity and Impact Dynamics - Proceedings of the International Symposium on Plasticity and Impact (ISPI 2001), Ed. L.C. Zhang, World Scientific Publishing Co. Pte. Ltd., 2001, pp.279-294. b) Articles in Journals 3.Junhui Li*, Duo Wang, Ji’an Duan, Hu He, Yang Xia, and Wenhui Zhu, Structural Design and Control of a Small-MRF Damper Under 50 N Soft-Landing Applications, IEEE Transactions on Industrial Informatics, Vol. 11, No. 3, 612-619, 2015. 4.Junhui Li*, Wei Wang, Yang Xia, Hu He, and Wenhui Zhu, The soft-landing features of a micro-magnetorheological fluid damper, Applied Physics Letters, Vol.106, 2015:014104. 5.Li Junhui*, Xia Yang, Wang Wei, Wang Fuliang, Zhang Wei, Zhu Wenhui, Dipping Process Characteristics Based on Image Processing of Pictures Captured by High-speed Cameras, Nano-Micro Letters, 2015, 7(1):1-11. 6. QIN Fei, XIA Guofeng, GAO Cha, AN Tong, ZHU Wenhui, Design of Experiment Methodology for Thermal Fatigue Reliability of Multi-row QFN Packages Based on Numerical Simulations, Journal of Mechanical Engineering(2014):50(18). 7. Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu, Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method, ASME Journal of Electric Packaging, 2013, 135:0410071-0410076. 8. T.C. Chai, X. Zhang, H.Y. Li, V.N. Sekhar, W.Y. Hnin, M.L. Thew, O.K. Kanvas, John Lau,W.H. Zhu, Impact of packaging design on reliability of large die Cu-Low-k (BDTM) Interconnect, IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 2, NO. 5, MAY 2012. 9. 夏国峰, 秦飞, 朱文辉, 马晓波, 高察, LQFP和eLQFP热机械可靠性的有限元分析, 半导体技术.2012.37(7):552-557. 10. 秦飞, 王珺, 万里兮, 于大全, 朱文辉, TSV结构热机械可靠性研究综述, 半导体技术.2012.37(11):835-831. 11. F.X.CHE, W.H. ZHU, EDITH POH, X.W.ZHANG, T.C. CHAI, X.R.ZHANG, Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Doping, Journal of Electronic Materials 40.3 (Mar 2011): 344-354. 12. F.X. Che, W.H. Zhu, Edith Poh, X.W. Zhang , X.R. Zhang, The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures, Journal of Alloys and Compounds507.1 (Sep 24, 2010): 215-224. 13. F.X. Che, W.H. Zhu, X.W. Zhang, T.C. Chong, Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods, IEEE Transactions on Device and Material Reliability (2008): 8(3), 455-463. 14. W.H.Zhu*, Sharry Ang, S. L. Gan, Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range, Journal of Materials Science(2005): 40(6), 1533-1537. 15. T.Y. Lin, M. Pecht, Diganta Das, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu, W.H. Zhu*, The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process, IEEE Transactions on Components and Packaging Technologies (2005): 28(2), 377-344. 16. W.H. Zhu*, M.Yoshida, Spall strength of thin aluminum foils at ultra high strain rate, Journal of Materials Science Letters (2002): 21, 1569-1572. 17. W.H. Zhu*, M. Yoshida, H. Tamura, K. Kondo, S. Tanimura, Multiple spalling of aluminum subjected to a pico-second stress pulse, Journal of Materials Science Letters (2001): 20(10), 961-963. 18. W.H. Zhu*, M. Yoshida, H. Tamura, K. Kondo, S. Tanimura, Multiple spallation in aluminum induced by ultra-short stress pulses, Special issue of International Journal of Materials Processing Technology (2001): 117(3). 19. S. Tanimura, K. Mimura, W.H. Zhu*, A dynamic constitutive equation and its experimental verification, Journal de Physique IV (2000): 10 (Pr9), 33-38. 20. S. Tanimura, K. Mimura W.H. Zhu*, Practical constitutive models covering wide ranges of strain rates, strains and temperature, Key Engineering Materials (2000): 177-180, 189-200. 21. W.H. Zhu*, G. Shi, S. Tanimura, Effect of soft material on insulating impact pressure into explosive, Key Engineering Materials (2000): 177-180, 237-242. 22. W.H. Zhu*, T.X. Yu, Z.Y. Li, Laser induced shock waves in PMMA confined foils, International J. of Impact Engineering (2000): 24(6-7), 641-657. 23. S. Tanimura, K. Mimura, T. Nonaka, W.H. Zhu*, Dynamic Failure of structures due to the great Hashin-Awaji earthquake, International J. of Impact Engineering (2000): 24(6-7), 583-596. 24. W.H. Zhu*, H.L. Xue, G.Q. Zhou, G.K. Schleyer, Dynamic response of cylindrical explosive chambers to internal blast load produced by a concentrated explosive charge, International J. of Impact Engineering (1997): 19 (9), 831-845. 25. W.H. Zhu*, Z.Y. Li, G.Q. Zhou, Z.H. Liu, Effects of Black paints on laser-induce shock waves in confined targets, J. of High Power Lasers and Particle Beams (in Chinese) (1997): 9(3), 458-462. 26. W.H. Zhu*, Z.Y. Li, G.Q. Zhou, X.Z. Li, Measurement of laser-induced shock waves by PVDF, J. of Experimental Mechanics (in Chinese) (1997): 12(2), 216-220. 27. Z.Y. Li, W.H. Zhu*, J. Cheng, D.H. Guo, H. Wu, Experimental study of high-power pulsed laser induced shocks in aluminum targets, Chinese Journal of Lasers (1997): A24 (3): 259-262. 28. Z.Y. Li, W.H. Zhu*, D.H. Guo, H. Wu, Experimental study of the effect of PMMA confinement on laser shock waves, Chinese Journal of Lasers (1997): A24 (2): 118-122. 29. W.H. Zhu*, H.L. Xue, Z.Y. Zhang, Combining analytical method with numerical solution to obtain blast load on chamber wall produced by an explosive charge, J. of National University of Defense Technology (1997): 19(6), 102-106. 30. Z.Y. Li, W.H. Zhu*, J. Cheng, G.Q. Zhou, Measurement of Laser Induced Shock Waves in Carbon Epoxy Composites, J. Materials Science Letters(1996): 15, 2122-2123. 31. Z.Y. Li, W.H. Zhu*, J. Cheng, G.Q. Zhou D.H. Guo, Experimental study on attenuation of high power laser-induced shock waves in copper, Chinese Science Bulletin (1996) (English edition): 41(20), 1694-1696. 32. W.H. Zhu*, G.Q. Zhou, J. Cheng, Dependence of yield Stress on grain size of nanocrystals, Acta Metallurgical Sinica (1996): 32(9), 959-965. 33. Z.Y. Li, W.H. Zhu*, J. Cheng, G.Q. Zhou, Nondestructive estimation of homogeneity in materials using laser shocks, Applied Laser Technology (in Chinese) (1996): 16(4), 166-168. 34. W.H. Zhu*, Z.Y. Li, G.Q. Zhou, J. Cheng, Dynamic loading in materials using laser-induced shocks, Applied Laser Technology (in Chinese) (1996): 16(2), 52-54. 35. W.H. Zhu*, H.L. Xue, J. Han, G. Liu, On the study of dynamics of explosive chambers, Advances in Mechanics (in Chinese) (1996): 26(1), 68-77. 36. W.H. Zhu*, H.L. Xue, C. L. Liu, J. Han, Experimental study on the explosive chambers under internal blast load, Explosion and Shock Waves (in Chinese) (1995): 15(4), 374-381. 37. Z.Y. Zhang, S. Huan, F.Y. Lu, W.H. Zhu*, Viscoplastic collapse mechanism of hot-spot formation in porous TNT explosives, Energetic Materials (in Chinese) (1994): 2(2), 36-42. 38. W.H. Zhu*, S. Huan, Principal difficulties in dynamic experiments of composites, Ordnance Materials Science and Engineering (in Chinese) (1993): No.6, 51-58. 39. W.H. Zhu*, C. Q. Liu, Study of unsteady flow of non-Newtonian fluids in annular pipes, J. of National University of Defense Technology (in Chinese) (1993): No. l, 105-110. 40. W.H. Zhu*, S. Huan, Carbon/epoxy composites under impact tension, J. of Ballistics (in Chinese) (1993): No.3, 70-75. 41. W.H. Zhu*, C. Q. Liu, Analytical solution of flow of second-order non-Newtonian fluids through annular pipes, Chinese J. of Applied Mathematics and Mechanics (1993) (English edition): 14(3), 209-215. 42. W.H. Zhu*, C. Q. Liu, Analytical solution for the unsteady flow of Maxwell fluids through annular pipes, Acta Mechanica Sinica (in Chinese) (1992): 24(1), 116-121. 43. X.M. Liu, W.H. Zhu*, X.Z. Li, Study on the viscoelastic properties of wet bull-femur bone under high strain rates, J. of Biomechanics (in Chinese) (1991): 5(7), 1-8. c). * Published contributions to academic conferences (partial list) 44. WU Wei, QIN Fei, ZHU Wenhui, Delamination Analysis and Reliability Design for CMOS Image Sensors Packages, 2013 International Conference on Electronic Packaging Technology & High Density Packaging, 2013, 507-511. 45. XIA Guofeng, QIN Fei, GAO Cha, AN Tong, ZHU Wenhui, Finite Element Based DOE Methodology for Thermal Fatigue Reliability Design of Multi-row QFN Packages, 2013 International Conference on Electronic Packaging Technology & High Density Packaging, 2013, 512-516. 46. 夏国峰,秦飞,高察,安彤,朱文辉,基于数值模拟的多圈QFN封装热疲劳可靠性试验方法,中国力学大会,2013. 47. Songfang Zhao, Guoping Zhang*, Chongnan Peng, Rong Sun*, S. W. Ricky Lee, Wenhui Zhu, Fangqi Lai. Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via. Electronic Components & Technology Conference (ECTC2013, Las Vegas) 81-85. 48. XIA Guofeng, QIN Fei, ZHU Wenhui, GAO Cha, MA Xiaobo, Interfacial Delamination and Reliability Design of Exposed Pad Packages, 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 588-594. 49. XIA Guofeng, QIN Fei, ZHU Wenhui, GAO Cha, MA Xiaobo, Effects of Solder Constitutive Models and FE Models on Fatigue Life of Dual-raw QFN Package, 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 595-599. 50. QIN Fei, ZHU Wenhui, GAO Cha, XIA Guofeng, MA Xiaobo, Optimal Thermal Design of a High Power Package Using the Design of Experiment(DOE), 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 611-615. 51. XIA Guofeng, QIN Fei, ZHU Wenhui, MA Xiaobo, GAO Cha, Comparative Analysis of Reliability between Dual-raw and Conventional QFN Packages, 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 616-619.(Outstanding Paper Award) 52. WU Wei, XIA Guofeng, QIN Fei, ZHU Wenhui, MA Xiaobo, Thermal Fatigue Life Optimization of QFN Package Based on Taguchi Method, 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 1128-1132. 53. Siew Hoon Ore, W.H. Zhu, Dr W.L. Yuan, Dr Nathapong Suthiwongsunthorn,Module Level Thermal Performance Characterization and Enhancement of Chip Stack and Package Stack Memory Devices,EPTC2010, Singapore, 8-10 Dec. 2010, P. 626-631. 54. K.Y. Au, S.L. Kriangsak, X.R. Zhang, W.H. Zhu and C.H.Toh, 3D Chip Stacking & Reliability Using TSV-Micro C4 Solder Interconnection, 2010 Electronic Components and Technology Conference, P.1376-1384. 55. John Beleran, Tan Hua Hong, Ong PL Wilson, Dr Zhang XR, Gatbonton Librado Amurao, Gaurav Mehta & Dr Zhu WH, Solutions for 45/40nm ELK Device Integration into Flip Chip and Wire Bond Packaging, 2010 Electronic Components and Technology Conference, P.1604-1612. 56. Y. B. Yang, X. R. Zhang, W. H. Zhu, J. C. Teddy, Y. W. Liang, S. Nathapong, C. Surasit, Reliability Design for Exposed Pad and Low-profile Leadframe Package, ICEPT2010, Xi An, P.643-647 (Best Paper award, 获最佳论文奖). 57. Siew Hoon Ore, Edith Poh S W, Dr. W.H. Zhu, Dr W.L. Yuan, Dr Nathapong Suthiwongsunthorn, Co-Design for Thermal Performance and Mechanical Reliability of Flip Chip Devices, ICEPT2010, Xi An, P.81-87. 58. Siew Hoon Ore, Dr. W.H. Zhu, Dr W.L. Yuan, Dr Nathapong Suthiwongsunthorn, A New Tool Development for the Thermal Design and Quick Performance Evaluation of FBGA Devices, ICEPT2010, Xi An, P.698-703. 59. X.R. Zhang, W.H. Zhu, B.P. Liew, M. Gaurav,etc,Copper Pillar Bump Structure Optimization for Flip Chip Packaging with Cu/Low-K Stack,EuroSime2010,Berlin, P.1-7. 60. Wei Sun, W.H. Zhu, Edith S. W. Poh, H.B. Tan and Richard Te Gan, Study of Five Substrate Pad Finishes for the Co-design of Solder Joint Reliability under Board-level Drop and Temperature Cycling Test Conditions, ICEPT –HDP 2008 (E3-08). 61. Wei Sun, W.H. Zhu, Kriangsak Sae Le and H.B. Tan, Simulation Study on the Warpage Behavior and Board-level Temperature Cycling Reliability of PoP Potentially for High-speed Memory Packaging, ICEPT –HDP 2008 (C3-05) (Best conference paper,最佳论文奖). 62. T.C. Chai, D.Q. Yu, W.H. Zhu and X.R. Zhang, Angled high strain rate shear testing for SnAgCu solder ball, the 58th Electronic Components and Technology Conference (ECTC2008), 27-30 May 2008, Florida, US, P.623-28. 63. Chai TC, Xiaowu Zhang, H.Y. Li, VN Sekhar, Hnin WY, Thew ML, OK Navas, John Lau, R. Murthy, S. Balakumar ,Tan YM, Cheng CK, SL Liew, Chi DZ, Zhu W.H., Impact of Packaging Design on Reliability of Large Die Cu/low-κ (BD) Interconnect, the 58th Electronic Components and Technology Conference (ECTC2008), 27-30 May 2008, Florida, US, P.38-45. 64. W.H. Zhu, Luhua Xu, John HL Pang, X.R. Zhang, Edith Poh, Y.F. Sun, Anthony Y.S. Sun, C.K. Wang, H.B. Tan, Drop Reliability Study of BGA Assemblies with SAC305, SAC105 and SAC105-Ni Solder Ball on Cu-OSP and ENIG Surface Finish, the 58th Electronic Components and Technology Conference (ECTC2008), 27-30 May 2008, P.1667-72. 65. S. Krishna S., W.H. Zhu, C.K. Wang, S.H. Ore, H.B. tan and Anthony Y.S. Sun, Thermal performance evaluation and methodology for pyramid stack die packages, Proceedings of Itherm2008, 28-31 May 2008, Florida, US, P.325-32. 66. Edith S.W. Poh*, W.H. Zhu, X.R. Zhang, C.K. Wang, Anthony Y.S. Sun and H.B. Tan, Lead-free Solder Material Characterization For Themo-mechanical Modeling, Proceedings of EuroSime2008, 20-23 April, 2008, Freiburg, Germany, P.627-34. 67. Wei Sun, W.H. Zhu, C.K. Wang, Anthony Y.S. Sun and H.B. Tan, Warpage Simulation and DOE Analysis with Application in Package-on-Package Development, Proceedings of EuroSime2008, 20-23 April, 2008, Freiburg, Germany, P.244-51. 68. F.X. Che and W.H. Zhu, Reliability assessment for Cu/Low-k structure based on bump shear modeling and simulation method, EPTC2007, Singapore, 10-12 Dec. 2007, P. 27-31. 69. F.X. Che, Edith Candy Poh, W.H. Zhu and B.S. Xiong, Ag Content Effect on Mechanical Properties of Sn-xAg-0.5Cu Solders, EPTC2007, Singapore, 10-12 Dec. 2007, P. 713-718. 70. Krishnamoorthi. S, W.H. Zhu, C.K.Wang, H.B. Tan and Anthony Y.S. Sun, Thermal Evaluation of Two Die Stacked FBGA Packages, EPTC2007, Singapore, 10-12 Dec. 2007, P. 278-284. 71. Weiliang Yuan, Wenhui Zhu, Palei Win, CK Wang, HB Tan, and Anthony YS Sun, "Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages", Proceedings of 8th International Conference on Electronics Packaging Technology (ICEPT 2007), August 14th – 17th, 2007, Shanghai, China, pp.597-600. 72. Wei Sun, C.K. Wang, W.H. Zhu, F.X. Che, Anthony Y.S. Sun and H.B. Tan, Ultra-thin Die Characterization for Stack-die Packaging, ECTC2007, Rero, 29 May-1st June, 2007, pp. 1390 - 1396. 73. F. X. Che, W. H. Zhu, Wei Sun, Anthony Sun, C.K. Wang and H.B. Tan, Comprehensive Modeling Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition, ECTC2007, Rero, 29 May-1st June, 2007, pp. 528-535. 74. F. X. Che, W. H. Zhu, Wei Sun, Anthony Sun and C.K. Wang, Development and Assessment of Global-Local Modeling Technique Used in Advanced Microelectronic Packaging, EuroSime2007, London, UK, 15-18 April, 2007, pp. 375 -381. 75. Wei Sun, W.H. Zhu, F.X. Che, C.K. Wang, Anthony Y.S. Sun and H.B. Tan, Study on the Board-level SMT Assembly and Solder Joint Reliability of different QFN Packages, EuroSime2007, London, UK, 15-18 April, 2007, pp 344-349. 76. W.H. Zhu, Sun Wei, Che F.X., Anthony Sun, C.K. Wang, H.B. Tan, Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement, EuroSime2007, London, UK, 15-18 April, 2007, pp. 579-586. 77. F.X. Che, W.H. Zhu, X.W. Zhang and T.C. Chong, Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods, EPTC2006, Singapore, 10-12 Dec. 2007, pp. A2.3. 78. S. Krishna, W.H. Zhu, C.K. Wang, H.B. Tan and Y.S. A. Sun, Thermal evaluation of two-die stacked FBGA packages, EPTC2006, Singapore, 10-12 Dec. 2007, pp. A1.3. 79. F.X. Che, E.C. Poh, W.H. Zhu and B.S. Xiong, Ag content effect on mechanical properties of Sn-Xag-0.5Cu solders, EPTC2006, Singapore, 10-12 Dec. 2007, pp. G1.5. 80. F. X. Che, W. H. Zhu, Wei Sun, and Anthony Y. S. Sun, Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints, ICEPT2006, Shanghai China, 27-29, Aug. 2006, pp.155-160. 81. Wei Sun, W. H. Zhu, F. X. Che, C. K. Wang, Anthony Y.S. Sun and H. B. Tan, Experimental and Numerical Assessment of Board-level Temperature Cycling Performance for Eutectic and Pb-free windows-Chip-Scale-Package (wCSP), ICEPT2006, Shanghai China, 26-29, Aug. 2006, pp.794-799 (Best conference paper, 获最佳论文奖). 82. F. X. Che, W. H. Zhu, Wei Sun, Anthony Sun and C.K. Wang, Application of Global-Local Modeling Technique in Electronic Packaging, 6th ASEAN ANSYS Conference, Singapore, 1-2 Nov, 2006 (no proceedings). 83. F.X. Che, W.H. Zhu and Anthony Y. S. Sun, Cyclic Bend Fatigue Reliability Investigation for Sn-Ag-Cu Solder Joints, EPTC2006, Singapore, 7-8 Dec. 2006, pp.313-317. 84. Wei Sun, W. H. Zhu, F. X. Che, C. K. Wang, Anthony Y.S. Sun and H. B. Tan, Experimental and Numerical Assessment of Board-level Temperature Cycling Performance for PBGA, FBGA and CSP, EPTC2006, Singapore, 7-8 Dec. 2006, pp.121-126. 85. Y.Y. Ma, Krishnamoorthi. S, C.K. Wang, Anthony Y.S. Sun, W.H. Zhu and H.B. Tan, On the Thermal Characterization of an Exposed Top Quad Flat No-Lead Package, EPTC2006, Singapore, 7-8 Dec. 2006, pp. 810-814. 86. W.L. Yuan, H.P. Kuah, C.K. Wang, Anthony Y.S. Sun, W.H. Zhu, H.B. Tan, and A.D. Muhamad, High-Speed Differential Interconnection Design for Flip-Chip BGA Packages, EPTC2006, Singapore, 7-8 Dec. 2006, pp. 76-81. 87. Gojun Hu, Andrew A. O. Tay, Yongwei Zhang, Wenhui Zhu and Spencer Chew, Characterization of Viscoelastic Behaviour of a Molding Compound with Application to delamination analysis in IC packages, EPTC2006, Singapore, 7-8 Dec. 2006, pp. 53-59. 88. Xueren Zhang, Tong Yan Tee, Hun Shen Ng, Jerome Teysseyre, Shane Loo, Subodh Mhaisalkar, Fong Kuan Ng, Chwee Teck Lim, Xinyu Du, Eric Bool, W.H.Zhu, Spencer Chew (2004), Hygro-thermo-mechanical Modeling of Mixed Flip-chip and Wire Bond tacked Die BGA Module with Molded Underfill. Proceedings of 2004 Electronic Packaging Technology Conference (EPTC2004), 10-12 Dec. 2004, Singapore (accepted). 89. T.Y.Lin, Diganta Das, Michael. Pecht and K.C.Teo, W.H. Zhu, X. Dong and G.H. Duan (2004), The Impact of SMD Post Baking Process on the Yield of Printed Circuit Board Assemblies. Proceedings of 2004 Electronic Packaging Technology Conference (EPTC2004), 10-12 Dec. 2004, Singapore (accepted). 90. W.H. Zhu, Sharry Ang, S. L. Gan and C.L. Toh (2004), Mechanical properties of molding compounds (MCs) under different moisture conditions and in a wide temperature range, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-systems, May 9-12, 2004, Belgium (accepted). 91. W.H. Zhu, S. Stephan, H. Pape and S. L. Gan (2003), Comparative study on solder joint reliability using different FE-models, Proceedings of 2003 Electronic Packaging Technology Conference (EPTC2003), 10-12 Dec. 2003, Singapore, P.687-694. 92. W.H. Zhu (2002), Stress design in a ball grid array (BGA) package, Proceedings of ANSYS User conference 2002, Nov. 2002, Singapore, P.1-12. 93. W.H. Zhu, Parametric characterization of warpage in electronic packaging. Proceedings of SEMICON Singapore 2002. 6-8 May 2002, Singapore, P.81-88. 94. S. Tanimura, T. Umeda, W.H. Zhu and K. Mimura, Evaluation of accuracy in measurement of dynamic load by using load sensing block method. Impact Engineering and Application (ELSEVIER) -Proceedings of the 4th International Symposium on Impact Engineering (ISIE/4), Ed. Akira Chiba, Shinji Tanimura and Kazuyuki Hokamoto, July 16-18, 2001, Kumamoto, Japan, Vol. 1, P.77-82. 95. W.H. Zhu, M. Yoshida, H. Tamura, K. Kondo and S. Tanimura: Multiple spallation in aluminum induced by ultra-short stress pulses, Abstract Proceedings of the International Conference on Processing and Manufacturing of Advanced Materials (THERMEC 2000), December 4-8, 2000, Las Vegas, USA, P.145 and THERMEC2000 - Proceedings International Conference on Processing and Manufacturing of Advanced Materials, Las Vegas, USA, December 2000:CDROM, Section A2, Vol 117/3 “Special Issue: Journal of Materials Processing Technology, Eds. T.Chandra, K Higashi, C.Suryanarayana & C.Tome, Elsevier Science, UK (October 2001)”. 96. W.H. Zhu, S. Tanimura, K. Mimura and T. Umeda: Dynamic response of new sensing block systems and its applications to dynamic buckling tests, Proceedings of ICTAM2000 (International Congress on Theoretical and Applied Mechanics), August 27- September 2, 2000, Chicago, USA, p.69-GM07. 97. W.H. Zhu, M. Yoshida, H. Tamura, K. Kondo and S. Tanimura: Spall of aluminum induced by pico-second laser pulses. Proceedings of Symposium on Shock Wave Japan, Tokyo University, March 16-18, 2000, Tokyo, p.461-464. 98. S. Tanimura, K. Mimura, W.H. Zhu: A dynamic constitutive equation and its experimental verification. Proceedings of DYMAT2000- the 6th International Conference on Mechanical and Physical Behavior of Materials under Dynamic Loading, Krakow, Poland, September 25-29, 2000, Pr9-33~38. 99. S. Tanimura, K. Mimura, W.H. Zhu and T. Umeda: A practical rate sensitive constitutive equation applicable to wide range of strain rates and material groups. JSME 6th Symposium on Impact Problem of Materials, Kyoto, Japan, December 2-3, 1999. 100. S. Tanimura, K. Mimura, W.H. Zhu and T. Umeda: On high speed material testing and buckling testing systems by using sensing block method. JSME 6th Symposium on Impact Problem of Materials, Kyoto, Japan, December 2-3, 1999. 101. W.H. Zhu, K.Y. Lam, C. Lu and T.X. Yu: Experimental determination of laser induced shock pressures in PMMA confined copper foils. Impact Response of Material and Structures, - 3rd International Symposium on Impact Engineering (ISIE), Ed. By V.P.W. Shim, S. Tanimura and C.T. Lim (held in Singapore, 7-9 December 1998), Oxford University Press, 1999, p.280-285. 102. W.H. Zhu, T.X. Yu and K.Y. Lam: Folding of a fabric strip under its own weight. Proceedings of the High Performance Computing Conference, Vol. 1, 23-25 September 1998, Singapore, p.50-54. 103. S.C. Suresh, W.H. Zhu, H. Zheng, Z. Xu and et al: Finite element analysis of chain sprocket system. Proceedings of the High Performance Computing Conference, Vol. 1, 23-25 September 1998, Singapore, p.547-555. 104. *Z.Y. Li, W.H. Zhu, J. Cheng, G.Q. Zhou and D.H. Guo: Measurement of laser induced shock waves in aluminum targets using PVDF gauges. Proceedings of SPIE - The International Society for Optical Engineering v2888, 1996, p.232-236.(* This paper was cited by EI) 105. W.H. Zhu, Z.Y. Li, X.Z. Li and G.Q. Zhou: Experimental study on laser-induced shock in copper targets (abstract paper). Proceedings of International Congress on Theoretical and Applied Mechanics (ICTAM): Japan, August 1996, p.651. 106. W.H. Zhu and H.L. Xue: Simulation and analysis on the strain growth in vibration of explosive chambers (abstract paper). Proceedings of International Congress on Theoretical and Applied Mechanics (ICTAM), Japan, August 1996, p.649. 107. W.H. Zhu,Theoretical analysis on vibration of chamber structures under impulsive loading. Proceedings of 2nd International Symposium on Impact Engineering (ISIE), China, Ed. by C.Y. Chiem, L. L Wang and S. Tanimura, September 2-6, 1996, p.110-115. 108. W.H. Zhu, H.L. Xue and G.Q. Zhou: Analysis on vibration of cylindrical explosive chambers under internal blast loading. Proceedings of 4th National Conference on the Explosive Mechanics (in Chinese) China, October 1995, p.100. 109. W.H. Zhu and H.L. Xue: Experimental study on the vibration of explosive chambers. Proceedings of 4th National Congress on Impact Dynamics (in Chinese) China, October 1994, p.66-72. 110. X.M. Liu, X.Z. Li, and W.H. Zhu: Experimental study of wet bull-femur bones at high strain rates. Proceedings of International Conference on Constitutive Laws of Engineering Materials (ICCLEM), China, October 1989, p.392- 395. d). Technical Reports 111. W.H. Zhu, Moisture effect on mechanical properties of molding compound. Internal Technical Report of Infineon Technologies, March 2004, p.1-65. 112. W.H. Zhu, Correlation of solder joint reliability between simulation and TCOB test, Internal Technical Report of Infineon Technologies, March 2004, p. 1-102. 113. W.H. Zhu and G. Shi, Evaluation of pressure contours induced by high explosive in storage chamber. Report No. CAE/99-17/CC, Institute of High Performance Computing, Singapore, May 1999, p.1-35. 114. W.H. Zhu, G. Shi, Addie Van Der Vegte and C. Lu, Survivability and penetration simulations of blast fragment warhead, Report No: CAE/9802/CC, Institute of High Performance Computing, Singapore, November, 1998, p.1-41. 115. H. Zheng, W.H. Zhu, S.C. Suresh and Z. Xu, Application of computational mechanics techniques for acoustic analysis of a chain/sprocket system, (Vols.1 and 2) Report No.9801, Institute of High Performance Computing, Singapore, 1998. 116. W.H. Zhu and T.X. Yu, Draping and folding of a fabric strip under its own weight. Report No. RI95/96.EG18—TR.01, Department of Mechanical Engineering, Hong Kong University of Science and Technology, October 1997, p.1-36. *Note: Conference paper list is incomplete since it collected mainly those papers for international conferences. Most of the national conference papers including those for 863 high technology topic conference on laser weapon effects and etc. are not cited here. 部分专利 (1)已授权专利

专利名称

授权

国别

专利

性质

专利号

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本人

排序

1

多圈排列无载体双IC芯片封装件

中国

实用

新型

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2011.06.30

1

2

多圈排列IC芯片封装件

中国

实用

新型

ZL201120228077.6

2011.06.30

1

3

多圈排列双IC芯片封装件

中国

实用

新型

ZL201120228063.4

2011.06.30

1

4

多圈排列无载体双IC芯片封装件及其生产方法

中国

发明

专利

ZL201110181830.5

2011.06.30

1

5

多圈排列IC芯片封装件及其生产方法

中国

发明

专利

ZL201110181837.7

2011.06.30

1

6

一种基板的多层隔片式IC芯片堆叠封装件

中国

实用

新型

ZL201120568213.6

2011.12.31

2

7

一种单载体MEMS器件封装件

中国

实用

新型

ZL201120568239.0

2011.12.31

1

8

一种双载体双MEMS器件封装件

中国

实用

新型

ZL201120568237.1

2011.12.31

1

9

一种双层MEMS器件堆叠封装件

中国

实用

新型

ZL201120568188.1

2011.12.31

1

10

中心布线双圈排列单IC芯片封装件

中国

实用

新型

ZL201120568217.4

2011.12.31

1

11

一种中心布线双圈排列IC芯片堆叠封装件

中国

实用

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ZL201120568212.1

2011.12.31

1

12

一种BT基板的悬梁式IC芯片堆叠封装件

中国

实用

新型

ZL201220141808.8

2012.04.06

1

13

四边扁平无引脚封装件

中国

实用

新型

ZL201220141710.2

2012.04.06

1

14

四边扁平无引脚多圈排列IC芯片封装件

中国

实用

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ZL201220250188.1

2012.05.30

1

15

一种引线框架的宝塔式IC芯片堆叠封装件

中国

实用

新型

ZL201220439870.5

2012.08.31

3

(2)尚未授权专利

序号

专利名称

申请

国别

专利

性质

申请号

专利申请日

本人

排序

1

一种球型光栅阵列IC芯片封装件及其生产方法

中国

发明

专利

201010569804.5

2010.12.02

1

2

多圈排列无载体IC芯片封装件及其生产方法

中国

发明

专利

201110181828.8

2011.06.30

1

3

多圈排列双IC芯片封装件及其生产方法

中国

发明

专利

201110181831.X

2011.06.30

1

4

中心布线双圈排列单IC芯片封装件及其制备方法

中国

发明

专利

201110454999.3

2011.12.31

1

5

一种双层MEMS器件堆叠封装件及其生产方法

中国

发明

专利

201110455037.X

2011.12.31

1

6

一种中心布线双圈排列IC芯片堆叠封装件及其生产方法

中国

发明

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201110455052.4

2011.12.31

1

7

一种双载体双MEMS器件封装件及其生产方法

中国

发明

专利

201110455053.9

2011.12.31

1

8

一种单载体双MEMS器件封装件及其生产方法

中国

发明

专利

201110455054.3

2011.12.31

1

9

一种基板的多层隔片式IC芯片堆叠封装件及其生产方法

中国

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专利

201110455062.8

2011.12.31

2

10

四边扁平无引脚封装件及其生产方法

中国

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2012.04.06

1

11

一种BT基板的悬梁式IC芯片堆叠封装件及其生产方法

中国

发明

专利

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2012.04.06

1

12

四边扁平无引脚多圈排列IC芯片封装件生产方法及封装件

中国

发明

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2012.05.30

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13

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中国

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201210582792.9

2012.12.28

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14

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201210582312.9

2012.12.28

4

15

一种Fan-out Panel Level BGA封装件的制作工艺

中国

发明

专利

201210542559.8

2012.12.15

1

16

一种扩展引脚的Fan-out Panel Level BGA封装件及其制作工艺

中国

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2012.12.14

1

17

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中国

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2012.12.12

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18

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中国

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2012.12.10

2

19

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201210523271.6

2012.12.9

2

20

一种基于腐蚀塑封体的扁平封装件制作工艺

中国

发明专利

201210523294.7

2012.12.9

4

部分奖项荣誉 (1)科技成果鉴定统计

序号

项目名称

鉴定时间

技术水平

组织单位

本人排序

1

多排矩阵式DIP封装技术研发

2010.11.14

国内领先

甘肃省科学技术厅

2

2

HZIP大功率器件封装技术研发

2010.11.14

国内领先

甘肃省科学技术厅

1

3

无载体栅格阵列封装技术研发

2010.11.14

国际先进

甘肃省科学技术厅

1

4

高密度SIM卡封装技术研发

2010.11.14

国际先进

甘肃省科学技术厅

2

5

SiP封装技术研发

2010.11.14

国际先进

甘肃省科学技术厅

2

6

TF/LFBGA封装技术研发

2010.11.14

国内领先

甘肃省科学技术厅

2

7

多芯片封装(MCP)技术研发

2011.12.20

国际先进

甘肃省科学技术厅

2

8

加速度传感器MEMS封装技术研发

2011.12.20

国际先进

甘肃省科学技术厅

1

9

eLQFP系列封装技术研发

2011.12.20

国际先进

甘肃省科学技术厅

2

10

多圈V/UQFN封装技术研发

2012.10.13

国际先进

甘肃省科学技术厅

1

11

多圈FCQFN封装技术研发

2012.12.16

国际先进

甘肃省科学技术厅

1

12

高密度窄间距小焊盘铜线键合封装技术研发

2012.12.16

国际先进

甘肃省科学技术厅

1

(2)中国半导体创新产品和技术

序号

获奖年份

获奖产品

本人排序

备注

1

2010

TF/LFBGA封装技术

2

2

2011

LGA/SiP封装技术

2

3

2012

多圈V/UQFN封装技术

1

(3)天水市科技进步奖

序号

年份

获奖名称

本人排序

类别

1

2011

SiP封装技术研发

2

一等奖

2

2012

多芯片封装(MCP)技术研发

2

一等奖

(4)甘肃省优秀新产品新技术

序号

年度

产品技术名称

本人排序

备注

1

2010

TF/LFBGA封装技术

2

2

SiP封装技术

2

3

2011

多芯片封装(MCP)技术研发

2

4

eLQFP封装技术研发

2

5

加速度传感器MEMS封装技术研发

1



特种微纳制造